Thermally Conductive Material, Silicon, 1 W/mK, 100 mm L x 100 mm W x 2 mm T

Thermal Insulation, Filler Pad, 3W/MK, 20 Support 00, 3.0mm, Silicone Rubber, 3.15 W/mK, 3 mm, 0.69 °C/W

Thermal Pad, Tflex HR600 Series, 2.8W/mK, Boron Nitride Filled, 0.5mm, 229mm

Thermal insulation, Filler pad T1, 40 support 00, Silicone, 5 W/mK, 1 kV, 2 mm, 0.565 °C/W

Thermal pad, silicone, 150X0.5MM, blue

Thermal pad, silicone, 150X1MM, blue

Thermal Insulation, Gap Filler, 150mm Square, Carbon, 3.2 W/mK, 1 mm

Heat Sink Pad, Silicone, 200 mm x 200 mm x 2 mm, 8 W/mK

Thermal pad, silicone, 200X3MM, blue

Thermally Conductive Material, Gap Fill, 2 Part, Silicon, 2W/mK, 50 ml

Thermal Pad, Non-silicone, 150 mm x 150 mm x 1 mm, 4 W/mK

Thermal pad, graphite, 240 W/mK, 0.25 mm

Thermal Conductive Material, GraphiteTIM, 400 W/mK, Graphite Sheet, 200 μm, 113 mm

Thermal Insulation, .040", 4" x 4" Board, Slit Pad 2000 S40, 2 W/mK, 2.5 kV, 1.016 mm, 10 ohm-m, 0.97 °C/W

Heat Sink Pad, Silicone, 150 mm x 150 mm x 2 mm, 10 W/mK

Heat Sink Pad, Silicone, 150 mm x 150 mm x 1.5 mm, 9 W/mK

Thermal Insulation, Transistor Case Insulation Pads, TO-218, 25pcs, Carbon, 0.178 mm

Insulation Kit, Bolt-On, 7.3 mm ID, 20.50 mm OD

Thermally Conductive Material, Acrylic Polymer

Thermal insulation, Mica, 2 kV, 0.2 mm